選擇您的國家或地區

EnglishFrançaispolskiSlovenija한국의DeutschSvenskaSlovenskáMagyarországItaliaहिंदीрусскийTiếng ViệtSuomiespañolKongeriketPortuguêsภาษาไทยБългарски езикromânescČeštinaGaeilgeעִבְרִיתالعربيةPilipinoDanskMelayuIndonesiaHrvatskaفارسیNederland繁体中文Türk diliΕλλάδαRepublika e ShqipërisëአማርኛAzərbaycanEesti VabariikEuskeraБеларусьíslenskaBosnaAfrikaansIsiXhosaisiZuluCambodiaსაქართველოҚазақшаAyitiHausaКыргыз тилиGalegoCatalàCorsaKurdîLatviešuພາສາລາວlietuviųLëtzebuergeschmalaɡasʲМакедонскиMaoriМонголулсবাংলা ভাষারမြန်မာनेपालीپښتوChicheŵaCрпскиSesothoසිංහලKiswahiliТоҷикӣاردوУкраїна
圖像僅供參考
請參閱產品詳細信息的規格。

FSBS10CH60SL

庫存 21 pcs 參考價格(美元)
26+
$9.88
製造商 型號:
FSBS10CH60SL
廠商品牌
Fairchild Semiconductor
部分描述:
SMART POWER MODULE 27PIN SPM27-B
數據庫:
無鉛狀態/ RoHS狀態:
不適用
庫存狀態:
原裝正品,有【 21 】現貨庫存。
發貨地:
Hong Kong
發貨方式:
DHL/Fedex/TNT/UPS

在線詢價

請用您的聯繫信息填寫所有必填字段。點擊“提交請求“我們會盡快通過電子郵件與您聯繫。或者發送電 info@igbt-semiconductors.com
型號
製造商
採購數量
目標價(USD)
公司名稱
聯繫人
邮箱
電話
在線留言
請輸入驗證碼並點擊“提交”
型號 FSBS10CH60SL
廠商品牌 Fairchild Semiconductor
庫存數量 21 pcs Stock
產品分類 分立半導體產品 > 電源驅動器模塊
描述 SMART POWER MODULE 27PIN SPM27-B
無鉛狀態/ RoHS狀態: 不適用
電壓 - 隔離 2500Vrms
電壓 600 V
類型 IGBT
系列 SPM®
封裝/箱體 27-PowerDIP Module (1.205", 30.60mm)
包裹 Bulk
安裝類型 Through Hole
當前 10 A
組態 3 Phase
基本產品編號 FSBS10

打包

我們提供最高質量,最經濟實惠的靜電屏蔽包裝。透明度為40%,便於識別IC(集成電路)和PCB(印刷電路板)。極其耐用的埋地金屬結構提供了有效屏蔽這些部件免受靜電損耗所需的FaradayCage性能。

所有產品都將包裝在防靜電袋中。裝有ESD防靜電保護裝置。
外部ESD包裝的標籤將使用我們公司的信息:零件Mumber,品牌和數量。
我們會在發貨前檢查所有貨物,確保所有產品都處於良好狀態,並確保零件是新的原始數據表。
所有貨物在包裝後確保沒有問題,我們將安全包裝並通過全球快遞發送。它具有優異的抗穿刺和抗撕裂性以及良好的密封完整性。
我們可以提供全球快遞服務,如DHLor FedEx或TNT或UPS或其他貨運代理商。

DHL / FedEx / TNT / UPS全球發貨

運費參考DHL / FedEx
1)。您可以提供快遞賬單以便裝運,如果您沒有任何快遞賬單,我們可以提供我們的賬戶。
2)。使用我們的帳戶進行裝運,裝運費用(參考DHL / FedEx,不同國家有不同的價格。)
裝運費用: (參考DHL和FedEX)
重量(KG):0.00kg-1.00kg 價格(美元):60.00美元
重量(KG):1.00kg-2.00kg 價格(美元):80.00美元
*成本價格參考DHL / FedEx。詳細收費,請聯繫我們。不同國家的快遞費用不同。



FSBS10CH60SL 產品詳情:

Title: FSBS10CH60SL Smart Power Module: Main Features, Parameters, and Application Scenarios Introduction: FSBS10CH60SL is a popular smart power module that is widely used in various electronic devices and industries. This article will focus on the module's main features, performance parameters, application scenarios, and usage. It will also discuss the different types of integrated circuits used in the manufacturing process and emphasize the importance of proper packaging and testing for component quality. Main Features and Performance Parameters: FSBS10CH60SL is an IGBT module with a 27-pin SPM27-B package that combines high power density, low power loss, and fast switching speed. It has an output voltage of 600V, a current of 10A, and a power of 200W. The module's accuracy and efficiency are impressive, with a typical collector-emitter saturation voltage of 2.3V at 25°C and an average on-state current of 12A. Additionally, it has a temperature range of -40°C to 150°C, making it suitable for a wide range of applications. Application Scenarios and Usage: FSBS10CH60SL is a versatile smart power module that is suitable for many electronic devices and industries. It can be used in power supplies, motor drives, and home appliances, among other things. Industries that use this module include automotive, industrial automation, and renewable energy, among others. Its high accuracy and efficiency make it ideal for applications that require high power density and low power loss. Different Types of Integrated Circuits: FSBS10CH60SL is a discrete semiconductor product that uses a mixed signal integrated circuit. When compared to digital or analog circuits, mixed signal circuits combine the benefits of both. Additionally, the module uses RF circuits, which are used in wireless communication systems. Complex Manufacturing Process: The manufacturing process of FSBS10CH60SL is complex and involves many steps. It starts with chip design, followed by cutting, cleaning, and laser processing. Once the chip is prepared, it undergoes back grinding, doping, exposure, vapor deposition, and etching. The finished product then undergoes proper packaging and testing to ensure component quality. Conclusion: FSBS10CH60SL is a highly versatile and efficient smart power module that is commonly used in various electronic devices and industries. This article highlighted its main features, performance parameters, application scenarios, and usage. It also discussed the different types of integrated circuits used in the manufacturing process and emphasized the importance of proper packaging and testing for component quality.

你可能感興趣: